WaferSense™ Auto Leveling Sensor

The first-ever wireless, wafer-like leveling device, Cyberoptics Semiconductor WaferSense ALS reduces total cost of ownership by enabling fast and accurate tool setup and maintenance and by providing data required to relate tool levelness with yield.

The system cuts coplanarity adjustments to just a few minutes work. WaferSense ALS goes where wafers go, senses what wafers sense and makes short work of fab coplanarity and leveling adjustments.

In a variety of wafer fabrication tools and equipment, WaferSense ALS saves equipment downtime, reduces maintenance manhours - typically by 80% - and optimizes yields.

Vacuum-compatible, the WaferSense sensor can be placed in FOUPs, cassettes, load locks and other process equipment to wirelessly transmit coplanarity data to a laptop with ±0.03 degree RMS accuracy.

WaferSense ALS combines performance accuracy with an intuitive 'bubble' graphic (LevelView™) that provides the user with real-time visual feedback to permit more precise and efficient leveling adjustments than possible with the human eye or a traditional bubble level.

Features

• 150mm, 200mm and 300mm form factors
• Accuracy ±0.03 degrees RMS
• Precision ± 0.003 degrees
• Operating range ± 4.0 degrees
• Thin (9mm) and light (150mm, 110g; 200mm, 150g; 300mm, 200g)
• Housing: electroless Nickel plated
• Bluetooth communications link
• Operates for six hours without recharging
• For use with Windows® 98SE, 2000, ME and XP operating systems