 Tamarack Scientific is the first company to offer full field projection lithography for solder bumping on 300 mm wafers.
Tamarack's projection scanner offers high intensity exposure - over 4000 mW/sq. cm. The Model 336 system uses full field mask for higher throughput and allows use of pellicles. The scanner uses a broadband lens with large depth of focus and provides an alignment accuracy of ±1µm.
Key benefits
- Scanning projection using full field mask
- Large area coverage (up to 300 mm diameter)
- Intermediate resolution (down to 4µm)
- Large depth of focus
- Accurate alignment (down to ±1µm)
Key features
Modular design for flexibility
The systems design allows:
> Mask size change
> Substrate size change
> Many substrate load options from manual to FOUPs
Tool control
> Robust Windows NT Operating System
> Two industrial PC approach
> Tool PC runs C++ DLLs
> Operator Work Station (OWS) uses VB screens for intuitive Graphic User Interface (GUI)
- SECS/GEM/HSMS compliant
GEM 300mm interface software is used for factory control over a TCP/IP network and an Equipment Front End Module (EFEM) provides operator interface that was designed to SEMI standards.
Mask and wafer loading automation
> 300 mm FOUPS with inserts for 200 mm wafers
> Quick wafer size change is software selectable
> 15 mask storage magazine with automatic retrieval
Model 252
Collimated proximity exposure system with automatic alignment
 Tamarack's Model 252 large area proximity mask aligner offers true non-contact photolithography designed to minimize yield issues often found in systems that rely on mask to substrate contact for imaging. At no time do the mask and substrate/wafer come into contact with each other.
Automatic alignment and optional substrate handling automation make the 252 a versatile system for both high volume and small to medium scale production of diverse components ranging from Solder Bumping, OLEDs, HDIs, Hybrids, FPDs, Ceramics and other similar applications where accurate imaging and alignment are required.
The Model 252 is a stand-alone, single sided alignment and exposure system that uses a state-of-the-art Pattern Recognition System incorporating dual viewing optics and CCD cameras for automatic mask to substrate alignment.
Variable proximity gapping and a highly collimated light source make this system ideal for use with wet or dry and thick or thin photoresists. High intensity illumination and full field image transfer in a single exposure provides for high throughput applications.
- True Proximity - provides non-contact imaging through the entire process, eliminating defects due to mask contact and contamination, resulting in higher yields
- Automatic alignment for high throughput and yields
- Optional automatic substrate handling for high volume applications
- High intensity, full field exposures up to 18in x 18in
- Flexible control of collimated exposure, providing accurate replication of fine line features in thick thin resists
- User friendly operator interface - recipe driven process control with data collection
- Automatic leveling, gap control and camera positioning.
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